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Hard Substrate lapping/polishing
Abrasives for Lapping and polishing
Thermal Conductivity 22 – 28 W/(m·K) Odor Odorless Solubility in Water Insoluble Other Properties Electrical Insulator
and ceramic polishing
Abrasives for lapping
DIA-LAB SPIRE POLYCRYSTALLINE DIAMOND SUSPENSION SLURRIES Size:1μm Hard Substrate lapping/polishingDIA LAB SPIRE poly diamond suspension slurries feature a high quality, ready to use water based and oil based formulation. These premium diamond slurries are engineered for versatility, excelling in a wide range of industrial applications such as metallographic analysis, optical finishing, metal polishing, and ceramic processing. Leveraging advanced dispersion technology, DIA LAB ensures that abrasive particles are consistently and uniformly
